QFN-Series
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Introduction

Based on copper lead frame, QFN (Quad Flat No-lead) or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. Providing both thermal and electrical enhancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process.

Application
Cellular Phones
Wireless LAN
Digital Cameras
Personal Digital Assistants
Feature
Low profile, small footprint and light weight
Free-form I/O design
Fine lead pitch 0.4mm
Excellent thermal performance
Excellent electrical performance
Good SMT performance
Cost effective package
PRODUCT LIST
Image
NO.
Package
Lead
Body Size(mm)
Wire Capability
Data Sheet